Category: Press Releases

YYForce Deploys Hospitality Service Robot at Aloft by Marriott Langkawi Pantai Tengah in Malaysia

YY Circle Malaysia-branded robot brings the Company’s human-and-robot workforce approach into a hotel operating environment SINGAPORE, Oct. 01, 2026 (GLOBE NEWSWIRE) — YYFORCE Inc. (NASDAQ: YFOR) (“YYFORCE” or the “Company”), a technology-enabled provider of workforce solutions and integrated facility management services, today announced the deployment of a YY Circle Malaysia-branded

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EMGA’s continued success in Brazil

EMGA Arranges EUR 100 Million Financing for BTG Pactual from COFIDES LONDON, Oct. 01, 2026 (GLOBE NEWSWIRE) — Emerging Markets Global Advisory LLP (“EMGA”) is pleased to announce the successful arrangement of a EUR 100 million debt financing facility for its long-standing Brazil-based client, BTG Pactual. The facility has been

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YYForce Secures S$15.96 Million in New Multi-Year Singapore Facility Services Contracts

New awards expand contracted business visibility across YYForce’s Singapore integrated facility management operations, with all contracts commencing in October 2026 and principal service periods extending approximately three years SINGAPORE, Sept. 29, 2026 (GLOBE NEWSWIRE) — YYForce Inc. (Nasdaq: YFOR) (“YYForce” or the “Company”), an AI-enabled workforce management and integrated facility

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ProductLife Group completes its transformation into a single, unified group with an end-to-end set of human and digital capabilities across life sciences

The consolidation of 26 businesses, acquired over six years, into one identity — now expressed through a new brand: PLG | Advanced Intelligence for Life Sciences PLG | Advanced Intelligence for Life Sciences PARIS, Sept. 29, 2026 (GLOBE NEWSWIRE) — ProductLife Group (PLG) today completes a multi-year transformation, uniting the

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ERS electronic Unveils Fully Automated 310 x 310 mm Panel-Level Packaging System to Power AI and Chiplet Architectures

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, today announced its fully automated panel-level packaging (PLP) system for 310×310 mm substrates. The machine integrates temporary carrier bonding, debonding, and detaping into a single automated platform at 13 panels per hour, eliminating inter-tool transfers across three thermally

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